Why "Delidding" & Direct Die method on Ryzen 7000? During delidding, or "heading", the processor's heat spreader is removed. For unsoldered processors, delidden is typically used to replace the thermal interface (TIM) between the CPU die and heatspreader with high-quality thermal compound or liquid metal before the heatspreader is reassembled. However, since the Ryzen 7000 processors are soldered, this is not an option as removing the indium solder would create too large a gap between the IHS and CPU dies.
Therefore, the Ryzen 7000 CPUs are primarily delidded for a possible installation of the CPU cooler directly on the CPU dies. In the case of Ryzen 7000 CPUs, this would be the I/O die (IOD) and one or two CPU dies (CCDs), so-called "chiplets". Experience has shown that by leaving out the heatps reader and mounting the CPU cooler directly on the die, the temperatures can be reduced by 10-20°C if liquid metal such as Conductonaut is used as a TIM. Corresponding tests were carried out by the content creators and tech YouTubers Roman "der8auer" Hartung, a professional overclocker and engineer, and Jason "JayzTwoCents" Langevin.
These enormous temperature improvements through Direct Die are also due to the heat spreader of the Ryzen 7000 processors. The heat spreaders for the AM5 platform introduced with Ryzen 7000 are thicker than older heat spreaders such as AM4. This was done to make older AM4 compatible CPU coolers compatible with the AM5 platform as well. In addition, the surface of the Ryzen 7000 heat spreader is significantly smaller at around 910 mm² compared to AM4 at 1,300 mm².